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i.Core MX95

The new Engicam module for a wide range of edge applications from Automotive connectivity to Industry 4.0 and IoT platforms, is based on EDIMM 2.0 standard. i.Core MX95 is based on NXP® i.MX95 processor with 2.0 TOPS NPU, 3D GPU  for advanced graphics, powerful vision and machine learning, real-time processing and security applications. 

 

CPU NXP® i.MX95
RAM LPDDR5@4200MTs
INTEGRATED MCU 1x Arm Cortex-M7, 1x Arm Cortex-M33
AI CAPABILITIES 2.0 TOPS NPU

Specifications

CPU

  • Manufacturer NXP
  • Processor Family i.MX95
  • Architecture ARM
  • Cores 6
  • Cores description Up to 6x Arm Cortex-A55
  • Frequency Up to 2.0 GHz
  • Integrated MCU Cortex-M7, Cortex-M33

MEMORY

  • RAM Type LPDDR5
  • RAM Frequency 4200 MT/s
  • RAM Size Up to 16 GB
  • STORAGE on board eMMC

AI ACCELERATOR

  • NPU eIQ® Neutron
  • NPU Capabilities 2.0 TOPS

GRAPHICS

  • GPU Arm Mali-G310
  • Features Arm Mali-G310 3D GPU supporting 50 GFLOPs FP32; OpenGL ® ES 3.2; Vulkan ® 1.3; OpenCL 3.0

VIDEO

  • LVDS Channels Dual
  • MIPI-DSI 1x 4 lane
  • MIPI-CSI 1x 4 lane

VIDEO PROCESSING

  • Decoder Support 4Kp60 H.265/H.264, 1x JPEG
  • Encoder Support 4Kp60 H.265/H.264, 1x JPEG

USB

  • USB2 1
  • USB3 1

PCIe

  • Generation Gen3
  • Number 1
  • Aggregations 1-lane

NETWORKING

  • LAN PHY 2x Gigabit Ethernet
  • MAC Interface 1x RGMII option

PERIPHERAL INTERFACES

  • UART 4x (Up to 8)
  • I2C 2x (Up to 6)
  • SPI 2x (Up to 7)
  • CAN 2x (Up to 5)
  • SDIO 2x
  • GPIOs
  • Audio I2S, SAI (up to 2)

OPERATING SYSTEM

  • Linux Yocto
  • Android

GENERAL

  • Form Factor EDIMM 2.0
  • Dimensions 67.6 x 32 mm
  • Power Supply single 5V
  • Operational Temperature -40°C up to +80°C
  • Availability 2039

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