Contact Us

Compare 0 Products

empty

Our modules are designed to ease mechanical integration, taking care to minimize the form factor. The extreme flexibility allows the development of a variety of products using the same carrier board for great cost optimization. All modules have guaranteed long-term product availability and are proven in hundreds of different applications under tough thermal and mechanical operating conditions. As members of the SGET and PICMG consortia, we can offer standard modules based on Qseven®, SMARC®, and COM Express® pinouts.

COM Express

Computer on modules based on COM Express standard form factor defined by PICMG consortium.

SODIMM

The SODIMM series is a modules family implemented on the SODIMM-200 connector and based on the EDIMM and EDIMM 2.0 versatile pinout definition.

MicroSOM

The Engicam MicroSOM modules family equipped with power-efficient processor ARM NXP® and ST® offer extremely high performances, real-time capabilities, and low-power operation.

SMARC

As members of the SGET consortium, we can offer standard modules based on SMARC® pinouts in our portfolio.

Qseven

As members of the SGET consortium, we can offer standard modules based on Qseven® pinouts that combine low power and small size.

NEWS

Extended longevity for i.MX6 products family

20 February 2023

NXP Technology Day 2022

21 October 2022

electronica 2022 is coming!

13 September 2022

A conversation with our CTO Milco Pratesi

31 January 2022

Blog Articles

Devtool command-line tool

Engicam BSP script

How to build a Yocto Image and Generate SDK

Device tree customization: adding RTC to device tree

#{title}

#{text}