Our partner KOANreleased an unofficial Yocto Project setup system for Engicam iMX6 boards family for the latest BSP available from Engicam.
The setup details are available on KOAN Github
MicroGEA STM32MP1 is running Linux-5.10, U-Boot-2021-01-rc2
22 December 2020
A new step into the partnership with Amarula Solutions to push Engicam SOM’s and Carrier board’s BSP onto Mainline U-Boot, Linux Kernel, Yocto/Buildroot, and Multimedia Open source projects.
After the release of PX30.Core in Mainline, now another project-based ST Microelectronics STM32MP1 SoM, Engicam MicroGEA STM32MP1 is up and running.
For this specific SoM, Engicam is ...
SAVE THE DATE!
Event: 'Engicam's SOM based on STM32MP1 processors' webinar, organized by Avnet Silica
Date: November 19, 2020
Time: 09:00 AM (Central European Time).
In this seminar our engineers will present our BSP for the modules, will illustrate the pre-configured virtual machine for Yocto and for the development of GUI on QT.
Practical cases of use will then be ...
Thanks to the partnership with Engicam Srl, Amarula Solutions started a project to push Engicam SOM’s and Carrier board’s BSP onto Mainline U-Boot, Linux Kernel, Yocto/Buildroot and Multimedia Open source projects.
The first success was the mainlining of #PX30Core, SOM based on Rockchip PX30, along with EDIMM 2.2 and CTouch 2.0. carrier boards.
Read the ...
Surround vision concept design base on Intel Apollo Lake
28 September 2020
Engicam presents a new solution based on Intel Apollo Lake CPU and FPD-Link III standard i/f
Please follow the video for more info:
https://www.youtube.com/watch?v=6v1rAvJBpL8&t=30s
Enjoy our weekly Webinars & Demo dedicated to hardware and software combination of Engicam products.
Enjoy the first ones:
- Setting up a system for multimedia content streaming with Gstreamer
- Face detection face and recognition for AI and Machine learning technologies.
To stay up to date with our latest webinars and demo, make sure to subscribe to ...
Starting from today, Amarula Solutions has begun a project to push the Engicam SOM’s and Carrier board’s BSP onto Mainline U-Boot, Linux kernel, Yocto/Buildroot Other Multimedia open-source projects.
https://www.amarulasolutions.com/blog/news/engicam-mainline-project/
A complete webinar dedicated to Engicam BSP, the platform that lets the customer creates in a quick and easy way the software for his embedded system.
Let's go into details on https://youtu.be/bfPBW7d1ZWk.
The newer STM32MP1 from ST with 800MHz core speed is now available.
The performance upgrade enlarges the application area for this strong MPU in an ultra-small 25x25 mm SOM.
Contact us for test samples and support by our team.MicroGEA STM32MP1
Engicam S.r.l.
Progetto co-finanziato dal POR FESR Toscana 2014-2020
ASSE 1 - AZIONE 1.1.5 – Sub-azione a1 “Progetti di ricerca e sviluppo delle MPMI” (Bando 2) - Decreto 31.05.2017 n. 7429”
Engicam S.r.l.
AVEM - Modulo Embedded per visione avanzata
Progetto finanziato nel quadro del POR FESR Toscana 2014-2020
Engicam S.r.l.
AVEM - Embedded module for advanced version
Project co-financed under Tuscany POR FESR 2014-2020
Engicam S.r.l.
Progetto di R&S: LOCOMUI Driver - “Low Power Consumption Multimedia Info Point Driver”
Progetto finanziato nel quadro del POR FESR Toscana 2014-2020
L’obiettivo del progetto LOCOMUI Driver è stato quello di realizzare una piattaforma flessibile IOT che unisse i benefici di prestazioni e bassi consumi
Engicam S.r.l.
Project of R&S: LOCOMUI Driver - “Low PowerConsumption Multimedia Info Point Driver”
Project co-financed under Tuscany POR FESR 2014-2020
The overall objective of the LOCOMUI Driver project was to create a flexible IOT platform that combines the benefits of performance and low consumption
Engicam S.r.l.
Progetto ENGICAM USA - “Partecipazione fiere internazionali Electronica 2016 e 2018 (Monaco di Baviera) e Embedded World 2017 e 2018 (Norimberga), per la promozione dei ns. prodotti sul mercato americano. Inoltre realizzazione del sito web in lingua inglese per la promozione dei ns. prodotti per il mercato americano ed internazionale”.
Progetto finanziato nel quadro del POR FESR Toscana 2014-2020 – Azione 3.4.2 Internazionalizzazione 2017 – D.D. 7161 del 24/05/2017.
Engicam S.r.l.
Project ENGICAM USA - “Joining to the international exhibition Electronica 2016 and 2018 (Munich Bavaria) and Embedded World 2017 e 2018 (Nuremberg), for commercial promotion on the American marketplace of the Engicam products.
English website creation to commercial promote on the Engicam products on the American & international marketplace”.
Project co-financed under Tuscany POR FESR 2014-2020 – Action 3.4.2 Internationalization 2017 – D.D. 7161 del 24/05/2017.
Engicam S.r.l.
Progetto ENGICAM USA 2019 - "Partecipazione fiere internazionali: “Embedded World 2019” Norimberga dal 26 al 28 febbraio 2019 e “Embedded World 2020” Norimberga dal 25 al 27 febbraio 2020."
Progetto finanziato dal POR CREO FESR Toscana 2014 – 2020 - Azione 3.4.2 Internazionalizzazione 2018 – D.D. 12057 DEL 23/07/2018 - D.D. 12488 DEL 18/07/2019
Engicam S.r.l.
Project ENGICAM USA 2019 - Participation in international fairs: "Embedded World 2019" Nuremberg from 26 to 28 February 2019 and "Embedded World 2020" Nuremberg from 25 to 27 February 2020.