Seminar: Introducing SOMs STM2MP2 based for industrial application

18 November 2024

We are pleased to invite you to our seminar in collaboration with Avnet Silica and STMicroelectronics to introduce the new STM32MP2 high-speed and low-power MPU series. The STM32MP2 series features up to two Arm Cortex®-A35 cores at 1.5GHz and a Cortex®-M33 core at 400MHz, supporting connectivity peripherals such as 3 Gbit Ethernet, Ethernet Switch, TSN, PCIe, USB3, LVDS, DSI, and camera ...

Electronica 2024 - Hall B4 - Booth 339

12 November 2024

Visit us at the leading trade fair and conference for electronics in Messe Munchen. We’ll be available for an interactive session to review our latest offering and answer your questions. Join us!

New release: Debian 12 Bookworm for i.Core MX8M Plus 2GB

01 October 2024

We are pleased to announce the Debian 12 Bookworm release for i.Core MX8M Plus 2GB. You can find a quick start guide on our Wiki: https://www.engicam.com/art/229960/Debian-12-Bookworm-quick-start-guide The full source code is available on GitHub: https://github.com/engicam-stable/flexbuild/

New Products are coming soon

22 July 2024

We are excited to announce that a new range of innovative products based on cutting-edge technology will soon be available. Here’s a sneak peek at what’s coming: SOM i.Core MX91 based on the newest NXP®’s i.MX 91 processor HMI #Rear Mount Micro 5": New Capacitive touch screen 5” open frame MicroSOM standard C.Touch GEN 3 - Capacitive ...

NEWS! C.Touch 3.0 Carrier Board now supports Windows 10

16 April 2024

Our new C.Touch 3.0 Carrier Board now supports Windows 10. This is our first release of a Windows 10 operative system optimized for ARM modules.

New SOM based on the Next-gen STM32 MPUs by ST®

12 April 2024

Introducing our latest advancements: the SmarCore STM32MP2 and i.Core STM32MP2. modules, powered by the cutting-edge STM32 MPUs from ST® Microprocessors. Designed for the demands of Industry 4.0 and advanced edge computing, these EDIMM 2.0 and SMARC SOMs boast an industrial-grade 64-bit MPU, ensuring both security and performance. Equipped with single or dual Arm® ...

The thermal challenges in the embedded processors

03 October 2023

In the rapidly evolving landscape of embedded systems and electronics, the challenges posed by thermal issues in the embedded industry have reached a critical point. Imagine a world where every device, from smartphones to autonomous vehicles and industrial control systems, is deeply linked with embedded processors that deliver exceptional performance and intelligence. While this vision is ...

Extended longevity for i.MX6 products family

20 February 2023

Long-term product availability and full support at hardware and software level, are some of the key values that have always guided our work and our commitment to customers. For that reason, we are excited to announce the extended minimum product availability to 2035 for our modules based on NXP® i.MX6S/DL/D/Q, i.MX6SX, i.MX6UL. The extension is due to NXP's inclusion of i.MX 6 ...

A conversation with our CTO Milco Pratesi

31 January 2022

Today we are pleased to have a talk with Milco Pratesi, co-owner, and CTO of Engicam. The past two years represented perhaps the most complex period for the world of electronics at the supply chain level. What is the lesson learned here? The pandemic situation has made evident a problem that has been known for a long time in our sector: the concentration of silicon in a single area of ...